Employment Opportunity/

Thermal Simulation Engineer

Summary of Job Profile                                                                        
1. Thermal modeling of electronic systems and thermal management solutions using FEA, CFD, and analyzes based on first principles                                       
2. Applying mechanical CAD methods to analyze the thermal properties and behavior of  product
3. Applying the same methods to analyze, develop and specify package related design rules and to characterize the thermal and mechanical features of the product
4. Assessing design and hardware limitations of products related to thermal properties of packaged chips in typical product applications and help to develop appropriate product and platform characterization and verification methods
                                                                        
Essential Duties & Responsibilities                                                                         
1. Developing simulation and modeling methods for thermal analysis of packaged chips and perform parametric studies
2. Support of proposals contributing conceptual thermal designs, costs & performance estimates
3. Good knowledge in numerical simulation of thermal on printed-circuit boards and in reference systems
4. Knowledge of some of the following software tools: Ansys IcePAK, Mentor Graphics FloTHERM
5. Experience as a technical team member in development projects
6. Experience in thermal testing techniques and instrumentation
7. Excellent problem solving ability                                                                        
8. Excellent people skills to include collaborating in a multi-disciplinary, diverse, and dynamic team environment, including working with design engineers to optimize overall design solutions
9.Outstanding work ethic and commitment to organizational success    
                                                                    
Knowledge, Skill, Abilities(KRA's)required to successfully perform the job                                                                        

1. Knowledge of heat transfer, thermal management, and cooling of electronics                                                                        
2. Experience using thermal simulation software for transient and steady state analysis                                                                        
3. Thermo-Dynamics, Understandable to heat transfer process, Good problem interpretation skills                                                                        
4. Team work, ECU system knowledge will be added advantage , Familiar with data transfer portal usage, Proficient with Microsoft Office products
5. Cope up with challenging working conditions
6. Ansys ICEPAK/Flotherm (Must) - Ansys Workbench, Catia (Added Advantage) Allegro Cadence (Basics)*
                                                                    
Education,Experience,Licensure,Certification required for the position
Experience:    2-3Years
Qualification:  B tech / BE in Electronics & Communication Engineering
Specific Technical Qualification/Certification : CFD simulation certification courses or trainings from ansys or any other organization,Recognized institutions will be added advantage
                                                                    
Competencies required to successfully perform the Job 
Technical Competencies:
1. Expertise in CFD software (ICEPAK/FLOTHERM)
2. Automotive domain knowledge will be added advantage
3. Experience in thermal resistance network
                                                                        
Non- Technical Competencies:
1. Capable to manage the project and deliver according to requirement
2. Proficient with Microsoft Office products
3. Excellent communication skills (written, verbal, & presentation)
4. Very good team player along with right attitud